I-Heatsink Yamemori ye-DDR5: Isisindo Esingeni Sephambili Sokulula Kwamemori Ephezulu

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Iphepha Lesi

Izinkomo

Ngiyabuzisa

Iphutha

Vumela Nethu

ukupheka imemori yeddr5

I-Heatsink yemimori ye-DDR5 iyabonisa ukuphumelela okukruthelwa kakhulu kwehlakanipha le-RAM, yenziwe ngokosizo lwezinhlanhla zokufika kumaqondana amathathu. Le solushoni yokuhlakanipha enobuchwepheshe ibonisa ukunyekeza kwamagolojwe emanzini noma kupha, futhi kuyahlukanisa izinhlobo ezifanayo zezinhlobo ezingcono ukunciphisa isayizi esikhundleni sokucima. I-Heatsink ihlinza ngokuhambisana nezindleko ezincrengwe zeDDR5, eyasebenza kumagigili aphakathi nezinsuku ezingaphantsi kwayo. Izinto ezahleliweyo zokucima ziyasiza ukuhambisana nokucima kwezimpawu zememori kanye nezinye izicelo, ukuvikela ubude bendawo noma xa kusebenzwa kakhulu. Isicathamiyo somthwalo sibonisa ukubaleka okulungile kwezilayisi ezivikela ukwenza kohlaka, ukuthuthukisa uhlelo lwokuhlakanipha ngokuzenzekelayo. Le heatsinks kuyadinga ukulungiswa ngokuthi kwenze umkhiqizo wokuhanjiswa kwamandla weDDR5, obangela ukutula okungenani ku-6000MHz. Ukunyekeza kuyadinga ukuba khansela ukunyekeza ukuthi kuthinte ukuthi kuthinte imithombo yamaPC ayiningi futhi lithinte ukuthi kuhlakaniphe ngokugcwele. Le heatsinks ye-DDR5 manje inamanye amaqhinga ohlelo, akhona ukubonakala kwe-RGB nezinye izinhlaka ezijabulisa, ukwenzeke ukuthi kube yimali nezoyilo kwezindawo zokudlala.

Amagaba Amahlula Ngoku

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HPE 64GB 2Rx4 PC4-3200Y-R Smart Kit

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HPE 2TB SAS 12G Midline 7.2K SFF (2.5in) SC 1yr Wty 512e Ufirma ewathintekayo Edigithaliwe YehhDD

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HPE 1.2TB SAS 12G Midline 10K SFF (2.5in) SC 1yr Wty 512e Ufirma ewathintekayo Edigithaliwe YehhDD

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Izikhethi zememori ye-DDR5 zinikeza izintulelo eziyisisekelo ezimbalwa okwenza kube yimalwa kwezinhlelo zokusebenza zamadoda. Okokuqala, zinikeza ukuphatha kwezindleko ngokukhulu, ukuhlukaniswa kwehla kwezindleko evela kumakhasi aphezulu asebenzisa i-DDR5 esebenza ngamagigili aphakathi kokuqala. Lokhu kuchaza ukucima okuhle kwezinhlelo nokudala, ukungena kwehla kwezindleko futhi kungenzeka ukuthulwa kwememori. Ukuncipha kwehla kuholela kakhulu kumemori ye-DDR5 ukugcina amagigili akhombisiweyo ngendlela ethembekile, ukindeza ukusebenza okuningi lapho kusebenzwa ekugameni, ukuhlelwa kwesithathu, noma kuzindleko eziphambene nezilwane. Lezi zikhethi zidizaynwe ngokufaka phambili ukuthuthukiswa, zingasebenzela kakhulu kuzindleko zomemu elandelayo. Izindawo ezahleliweyo ezisetshenziswa kubunzuluku bazo, njengoba yesilwane esiphelile noma isilwane esibovu, zinikeza ukuxhumana kwezindleko ngendlela enhle futhi zingahlabe ngokulula. Izingxenye eziningi zazo zinezinhlelo yokufaka engasingeki amathuluzi, okwenza kube lula kakhulu kubasebenzisa nabo abangaziwa futhi nabalingi. Ukuthunyelwa kwezikhethi lezi kuhlakanipisa kanje nobuwo bakho bejika nezinhlelo zokugcina, ngekho lokhu kunezinhlelo ze-RGB lighting ongayohlukanisa nezinye izinto zenhlelo. Ubude bokudla kubo buhamba nomaqu kuholela kakhulu ukuthi bezifanakathale kakhulu nezinye izinkomba zememu futhi nezinhlelo zencanti, futhi ubungovu bakho bekuxazulula inqubo yokudinga amafani amanye noma amanye amakhono. Ukuhlaselwa kwezikhethi zememori ye-DDR5 okuhambayo kuholela kakhulu ukuthi kungabuyi kudingeka ukuthenge futshe, okwenza kube yimalwa kakhulu kwezinhlelo zokusebenza nezokuthula.

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Umgca wokubandlela Amathameli

Ukusebenzela kweDDR5 yohlwempu wephakeme ikhona lelithuthuko elikhulu kakhulu ekuxilweni kwehlwempu. Kwisigodi, ukudityaniswa kunokwelapha okuningi kwegesi lokushisa, kunezindlela ezinhle zokubandakanya ishisa esiyinto evelayo ngemikhiqizo yesilinda. Le phakeme inenye yeendawo ezithile zokusebenza nezixhobo zokugcinwa ishisa apho kuyiqinisekisa ukulayisha ishisa kwiintambo zephakeme kuye kwindawo yokuhlamba. Le ndlela ithuthukisa ukusebenza kokuqala kweDDR5 apho iifrekwensi zihamba ngaphezu kuka6000MHz, ukuhlaba ishisa ngokuphelele nangona kukhokelelwa ngokuphelele. Le ndlela yenziwe ngokuchazwe indawo yokuvuleka apho kuzalwa amandla wokuxhasama, okongeza ukusebenza kwehlwempu ngaphandle kokunyusela amafani okanye ukuthatha amandla.

Ubungakanani Bucopho

Ukucaciswa kwalindlela yokudityanisa izinkawuntisela zememori ye-DDR5 kubekisa imikhiqizo yamandla, usebenzisa imikhawulo emkhukhuleni ehlelwe ngokuzithola kwemvelo yesitshalo fanye nokuphepha. I-aluminum noma i-copper enobunzima obuphezulu iba yisisekelo, etholwe ngokuba yabo bonke ukuxhumana nezimalo nokuphepha okude. Inkampani yokwenza iyasebenzisa ukugcina okuthile kwe-CNC ukwakha uhlelo lwezifuba nokubona okuphelele, ukuze kuthuthukwe ukusebenza kwe-emfanithe. Ukugcinwa kwenqanawe kufaka phakathi izinhlelo ezintsha zokungena noma ukubhonya i-nickel okungenzeka kuphela ukuvikela kwe-corrosion engenhalela futhi ukuthuthuka kwezimalo. Le ndlela ephambene nezimalo ikusisa ukuthi izinkawuntisela zilinde isitshalo fanye nokuhlanjwa kwazo kude, noma emaphakathini amaningi.

Isigama sokufanana

Ukulingana nokuthi i-heat sinks yamemori ye-DDR5 kuyindlela yokubonisa ukucwangciswa okuhle kwezinhloso zokuxhumeka kwamanye amasistimu wokusebenza. Isimo esincane sokulayishwa kumele kungaphakathi nezinhlobo eziningi zezinhlobo zokulindela CPU fomu nezinhlobo zokugcinwa, noma kunike isebenta sokulula. Indlela yokuhlola inqubo yokuxhuma okulinganayo eyenza kube yimali ehlukileyo ngaphandle kokudinga izicathami zesicelo noma izibokezo. Le ndlela yokwenzeka inciphise ukulingana nezinhlobo ezifanayo, enqatisha ukungahlangani nezinye izinto ngenxa yokwenza indawo ephezulu yokusula kweyohlu. Ukulingana kumele kube kunesikhwama sokufaka, ngaleyo ndlela izixhobo ze-RGB ezijwayelekileyo zisebenze ngokuzenzekelayo nezixhobo zokulawulisa ukulinda zase-motherboard.